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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability

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Kim, HJ / Chung, CK / Yim, MJ / Hong, SM / Jang, SY / Moon, YJ / Paik, Kyung-Wookresearcher
Publisher
IEEE
Issue Date
2006-05-30
Language
English
Citation

IEEE 56th Electronic Components and Technology Conference, pp.952 - 958

URI
http://hdl.handle.net/10203/1236
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MS-Conference Papers(학술회의논문)
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