Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, HJ | ko |
| dc.contributor.author | Chung, CK | ko |
| dc.contributor.author | Yim, MJ | ko |
| dc.contributor.author | Hong, SM | ko |
| dc.contributor.author | Jang, SY | ko |
| dc.contributor.author | Moon, YJ | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2007-09-03T06:37:08Z | - |
| dc.date.available | 2007-09-03T06:37:08Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2006-05-30 | - |
| dc.identifier.citation | IEEE 56th Electronic Components and Technology Conference, pp.952 - 958 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/1236 | - |
| dc.language | English | - |
| dc.language.iso | en_US | en |
| dc.publisher | IEEE | - |
| dc.title | Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability | - |
| dc.type | Conference | - |
| dc.identifier.wosid | 000238566600146 | - |
| dc.identifier.scopusid | 2-s2.0-33845591818 | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 952 | - |
| dc.citation.endingpage | 958 | - |
| dc.citation.publicationname | IEEE 56th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | San Diego, CA | - |
| dc.embargo.liftdate | 9999-12-31 | - |
| dc.embargo.terms | 9999-12-31 | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
| dc.contributor.nonIdAuthor | Kim, HJ | - |
| dc.contributor.nonIdAuthor | Chung, CK | - |
| dc.contributor.nonIdAuthor | Yim, MJ | - |
| dc.contributor.nonIdAuthor | Hong, SM | - |
| dc.contributor.nonIdAuthor | Jang, SY | - |
| dc.contributor.nonIdAuthor | Moon, YJ | - |
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