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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Studies on double-layered metal bumps for fine pitch flip chip applications Son, HY; Yeo, YW; Jung, GJ; Lee, JK; Choi, JY; Park, CJ; Suh, MS; Cho, SJ; Paik, Kyung-Wook, EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v.2005, pp.95 - 100, 2005-12-11 | |
| Cu/SnAg double bump flip chip assembly as an alternative of solder flip chip on organic substrates for fine pitch applications Son, HY; Jung, GJ; Lee, JK; Choi, JY; Paik, Kyung-Wook, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.864 - 871, IEEE, 2007-05-29 |
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