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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Highly Reliable Flip Chip on Flex Package using Multi-layered Anisotropic Conductive Film Yim, MJ; Hwang, JS; Kim, JG; Ahn, JY; Kim, HJ; Kwon, WS; Paik, Kyung-Wook, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging 2002, pp.0 - 0, 2002-12 | |
| Anisotropic conductive adhesives with enhanced thermal conductivity for flip chip applications Yim, MJ; Hwang, JS; Kim, JG; Kim, HJ; Kwon, W; Jang, KW; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.159 - 164, IEEE, 2004-06-01 | |
| Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications Yim, MJ; Kim, HJ; Chung, CK; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.338 - 343, IEEE, 2006-05-30 | |
| Curing and bonding behaviors of Anisotropic Conductive Films (ACFs) by ultrasonic vibration for flip chip interconnection Lee, KW; Kim, HJ; Yim, MJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.918 - 923, IEEE, 2006-05-30 | |
| Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability Kim, HJ; Chung, CK; Yim, MJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.952 - 958, IEEE, 2006-05-30 |
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