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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Novel non-conductive films(NCFs) with multi-functional epoxies and silica fillers for reliable NCFs flip-chip-on-organic boards Chung, CK; Kim, HJ; Paik, Kyung-Wook, 2006 International Conference on Electronic Materials and Packaging, EMAP, 123, 2006-12-11 | |
| Degradation mechanism and reliability of flip chip interconnects using anisotropic conductive adhesives for high current density packaging applications Yim, MJ; Kim, HJ; Chung, CK; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.338 - 343, IEEE, 2006-05-30 | |
| Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability Kim, HJ; Chung, CK; Yim, MJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.952 - 958, IEEE, 2006-05-30 |
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- 3 2006