Browse "MS-Conference Papers(학술회의논문)" by Title
Showing results 5561 to 5580 of 7321
| Studies on various 2-metal chip-on-flex (COF) packaging methods Suk, KL; Kim, JS; Paik, Kyung-Wook, 60th Electronic Components and Technology Conference, ECTC 2010, pp.1125 - 1131, ECTC, 2010-06-01 |
| Study by Thermal Analysis and Atmosphere Effect of Bi-Sr-Ca-Cu-O system by Electrical Conductivity 김호기, The Korean Ceramic Society, fall meeting, Seoul Univ., 1988 |
| Study of deformation texture of equal-channel angular pressed CP-titanium Liu, SM; Chon, SH; Park, Joong Keun, 5th International Conference on Processing and Manufacturing of Advanced Materials - THERMEC'2006, pp.3466 - 3471, 123, 2006-07-04 |
| Study of drop-performance improved lead-free solder by PCB pad finish Lee, YW; Lee, JH; Moon, JT; Park, YS; Paik, Kyung-Wook, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.668 - 672, 2009-12-09 |
| Study of Effects of Ammonia for Synthesis of Nano-sized BaTiO3 Powders via X-ray Photoelectron Spectroscopy 문산; 이현욱; 김도경, 2011년 한국세라믹학회 춘계총회 및 연구발표회, 한국세라믹학회, 2011-04-21 |
| Study of Effects of Ethylene Glycol for Growth of One-dimensional BaTiO3 Nanoparticles Prepared by Hydrothermal Reaction 박영태; 왕지은; 백창연; 김도경, 2017년 한국세라믹학회 춘계학술대회 및 총회, 한국세라믹학회, 2017-04-21 |
| Study of factors associated with biaxial texturing of cu tapes for ybco coated conductors No, Kwangsoo; Kim, YH; Sung, TH; Han, SC; Han, YH; Jeong, NH; Kim, CJ, ISS 2006, v.0, no.0, pp.0 - 0, ISS 2006, 2006-11-01 |
| Study of Growth Mechanism of doped Graphene on SiC Substrate using XeCl Excimer Laser Choi, Insung; Jung, Dae Yool; Choi, Sung-Yool; Lee, KeonJae, 2013 MRS Fall Meeting & Exhibit, Materials Research Society, 2013-12-05 |
| Study of Magnetic Microstructure of L10 FePt Epitaxial thin film Grown on MgO Substrate using Electron Holography 이완희; 유정호; 양준모; 박중근, 2013 대한금속재료학회 춘계학술대회, 대한금속재료학회, 2013-04-26 |
| Study of Mechanism and Real Time Simulation of Ammonia (NH3) Nitridation with a DFT Calculation and a KMC Simulation Yeo, Sang Chul; Lee, Hyuck Mo, 2014 TMS annual meeting (143rd), The Minerals, Metals & Materials Society, 2014-02-18 |
| Study of spalling behavior of Intel-metallic compounds during the reaction between electroless Ni-P metallization and lead-free solders Sohn, YC; Yu, Jin; Kang, SK; Shih, DY; Lee, TY, 2004 Proceedings - 54th Electronic Components and Technology Conference, v.1, pp.75 - 81, 2004-06-01 |
| Study of the Direct Electrochemical Oxidation of Methane at Ceria/Gas Interface 정우철, 2020 한국세라믹학회 추계학술대회, 한국세라믹학회, 2020-11-24 |
| Study of the effect of flux addition and Gd addition into the Y3Al5O12:Ce3+ Jeon, Duk Young; Jang, HS; Im, WB; Lee, DC; Kang, JH, Kyoto Joint Symposium, 2004 |
| Study of the Supercritical Water Oxidation Reactor Tubing of the Ceria production plant Kwon Hyuk Sang, 한국부식방식학회, pp.0 - 0, 2004-05-01 |
| Study of the Surface Charge in MIcro Sized PZT Thin Film by Kelvin Probe Force Microscopy 최시경; 안우송, 한국세라믹학회, pp.86 -, 2002 |
| Study on all solid-state lithium-ion cells containing LiMn2O4 thin film Kim, Ho Gi, , 1999-01-01 |
| Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding Kim, Tae Wan; Lee, Tae Ik; Lee, Sang Hoon; Kim, Taek Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-14 |
| Study on bubble formation in rigid-flexible substrates bonding using Anisotropic Conductive Films (ACFs) and their effects on the ACF joint reliability Kim, HJ; Chung, CK; Yim, MJ; Hong, SM; Jang, SY; Moon, YJ; Paik, Kyung-Wook, IEEE 56th Electronic Components and Technology Conference, pp.952 - 958, IEEE, 2006-05-30 |
| Study on Coined Solder Bumps on Micro-via PCBs Nah, JW; Paik, Kyung-Wook; Kim, WH; Hur, KR, Proceeding of the 3rd International Symposium on Electronic Materials and Packaging , pp.115 - 120, 3rd International Symposium on Electronic Materials and Packaging, 2001-11 |
| Study on Coined Solder Bumps on PCB Pads Paik, Kyung-Wook; Nah, JW; Kim, WH; Hur, KR, Proceedings of the 7th Pan Pacific Microelectronics Symposium, pp.79 - 85, 2002-02 |
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