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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding

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Kim, Tae Wan / Lee, Tae Ik / Lee, Sang Hoon / Kim, Taek Sooresearcher / Paik, Kyung Wookresearcher
Publisher
The Korean Microelectronics and Packaging Society
Issue Date
2015-10-14
Language
English
Citation

The 14th International Symposium on Microelectronics and Packaging

URI
http://hdl.handle.net/10203/204770
Appears in Collection
ME-Conference Papers(학술회의논문)MS-Conference Papers(학술회의논문)
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