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Chip-package co-design of power distribution network for system-in-package applications

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Kim, G. / Kam, D.G. / Chung, D. / Kim, Jounghoresearcher
Publisher
IEEE
Issue Date
2005-12-08
Language
English
Citation

6th Electronics Packaging Technology Conference, EPTC 2004, pp.499 - 501

URI
http://hdl.handle.net/10203/584
Appears in Collection
EE-Conference Papers(학술회의논문)
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