DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, G. | ko |
dc.contributor.author | Kam, D.G. | ko |
dc.contributor.author | Chung, D. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2007-06-21T01:13:49Z | - |
dc.date.available | 2007-06-21T01:13:49Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-12-08 | - |
dc.identifier.citation | 6th Electronics Packaging Technology Conference, EPTC 2004, pp.499 - 501 | - |
dc.identifier.uri | http://hdl.handle.net/10203/584 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Chip-package co-design of power distribution network for system-in-package applications | - |
dc.type | Conference | - |
dc.identifier.wosid | 000227716400091 | - |
dc.identifier.scopusid | 2-s2.0-28444490408 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 499 | - |
dc.citation.endingpage | 501 | - |
dc.citation.publicationname | 6th Electronics Packaging Technology Conference, EPTC 2004 | - |
dc.identifier.conferencecountry | SI | - |
dc.identifier.conferencelocation | Singapore | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, G. | - |
dc.contributor.nonIdAuthor | Kam, D.G. | - |
dc.contributor.nonIdAuthor | Chung, D. | - |
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