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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards

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Kim, Jingook / Rotaru, Mihai Dragos / Lee, Junwoo / Park, Jongbae / Alexander, Popov / layer, Mahadevan K. / Kim, Jounghoresearcher
Publisher
IEEE
Issue Date
2003-12
Language
English
Citation

5th IEEE Electronics Packaging Technology Conference, pp.45 - 50

URI
http://hdl.handle.net/10203/571
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EE-Conference Papers(학술회의논문)
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