DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Jingook | ko |
dc.contributor.author | Rotaru, Mihai Dragos | ko |
dc.contributor.author | Lee, Junwoo | ko |
dc.contributor.author | Park, Jongbae | ko |
dc.contributor.author | Alexander, Popov | ko |
dc.contributor.author | layer, Mahadevan K. | ko |
dc.contributor.author | Kim, Joungho | ko |
dc.date.accessioned | 2007-06-20T07:21:57Z | - |
dc.date.available | 2007-06-20T07:21:57Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2003-12 | - |
dc.identifier.citation | 5th IEEE Electronics Packaging Technology Conference, pp.45 - 50 | - |
dc.identifier.uri | http://hdl.handle.net/10203/571 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards | - |
dc.type | Conference | - |
dc.identifier.wosid | 000189435300009 | - |
dc.identifier.scopusid | 2-s2.0-84954073469 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 45 | - |
dc.citation.endingpage | 50 | - |
dc.citation.publicationname | 5th IEEE Electronics Packaging Technology Conference | - |
dc.identifier.conferencecountry | SI | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Kim, Joungho | - |
dc.contributor.nonIdAuthor | Kim, Jingook | - |
dc.contributor.nonIdAuthor | Rotaru, Mihai Dragos | - |
dc.contributor.nonIdAuthor | Lee, Junwoo | - |
dc.contributor.nonIdAuthor | Park, Jongbae | - |
dc.contributor.nonIdAuthor | Alexander, Popov | - |
dc.contributor.nonIdAuthor | layer, Mahadevan K. | - |
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