Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards

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dc.contributor.authorKim, Jingookko
dc.contributor.authorRotaru, Mihai Dragosko
dc.contributor.authorLee, Junwooko
dc.contributor.authorPark, Jongbaeko
dc.contributor.authorAlexander, Popovko
dc.contributor.authorlayer, Mahadevan K.ko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2007-06-20T07:21:57Z-
dc.date.available2007-06-20T07:21:57Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2003-12-
dc.identifier.citation5th IEEE Electronics Packaging Technology Conference, pp.45 - 50-
dc.identifier.urihttp://hdl.handle.net/10203/571-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleAnalytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards-
dc.typeConference-
dc.identifier.wosid000189435300009-
dc.identifier.scopusid2-s2.0-84954073469-
dc.type.rimsCONF-
dc.citation.beginningpage45-
dc.citation.endingpage50-
dc.citation.publicationname5th IEEE Electronics Packaging Technology Conference-
dc.identifier.conferencecountrySI-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorKim, Jingook-
dc.contributor.nonIdAuthorRotaru, Mihai Dragos-
dc.contributor.nonIdAuthorLee, Junwoo-
dc.contributor.nonIdAuthorPark, Jongbae-
dc.contributor.nonIdAuthorAlexander, Popov-
dc.contributor.nonIdAuthorlayer, Mahadevan K.-
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