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Collection's Items (Sorted by Submit Date in Descending order): 22701 to 22720 of 22906

22701
PCB power/ground plane edge radiation excited by high-frequency clock

Pak, J.S.; Kim, H.; Kim, Joungho; Lee, H., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.197 - 202, IEEE, 2004-08-09

22702
Accurate high frequency lossy model of differential signal line including mode-conversion and common-mode propagation effect

Baek, S.; Ahn, S.; Park, J.; Kim, Joungho; Kim, J.; Cho, J.-H., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.562 - 566, IEEE, 2004-08-09

22703
Compensation of ESD and Device Input Capacitance by using Embedded Inductor on PCB Substrate for 3 Gbps SerDes Applications

Ahn, Seungyoung; Baek, Seungyong; Lee, Junho; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, pp.499 - 504, IEEE, 2004-08-09

22704
Efficiency of differential signaling on cavity noise suppression in applications with refernce plane change

Lee, J.; Kim, J.; Kim, Joungho; Lu, A.C.W.; Fan, W.; Wai, L.L., IEEE International Symposium on Electromagnetic Compatibility, 2004, pp.203 - 208, IEEE, 2004-08-09

22705
Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module

Park, J.; Kim, H.; Pak, J.S.; Jeong, Y.; Baek, S.; Kim, Joungho; Lee, J.-J.; et al, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.592 - 597, IEEE, 2004-08-09

22706
Analysis of noise suppression techniques using embedded capacitor on split power bus in multi-layer package

Jeong, Y.; Kim, Joungho; Lu, A.C.W.; Wai, L.L.; Fan, W.; Lok, B.K.; Wong, C.K., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.215 - 220, IEEE, 2004-08-09

22707
Characterization of high-frequency plane-to-plane coupling through cutout in multi-layer packages

Lee, J.; Seng, Y.M.; Rotaru, M.D.; Iyer, M.K.; Kim, Joungho, 53rd Electronic Components and Technology Conference 2003, pp.1589 - 1593, IEEE, 2003-05-27

22708
Effect of decoupling capacitor on signal integrity in applications with reference plane change

Lee, J.; Lu, A.C.W.; Fan, W.; Wai, L.L.; Kim, Joungho, 53rd Electronic Components and Technology Conference, 2003, pp.1283 - 1288, IEEE, 2003-05-27

22709
Via and reference discontinuity impact on high-speed signal integrity

Kim J.; Kim, Joungho; Rotaru, M.D.; Chong, K.C.; Iyer, M.K., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.583 - 587, IEEE, 2004-08-09

22710
Optical Multistability Using Optoelectronic Feedback

LEE, CHANG-HEE; CHO, KUN-HO; SHIN, SANG-YUNG; LEE, SOO-YOUNG, IEEE Journal of Quantum Electronics, V.24, No.10, pp.2063-2069, 1998-10

22711
Prediction and Verification of Power/Ground Plane Edge Radiation Excited by Through-Hole Signal Via Based on Balanced TLM and Via Coupling Model

Pak, Jun So; Lee, Junwoo; Kim, Hyungsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.181 - 184, IEEE, 2003-10-27

22712
Significant Reduction of Power/Ground Inductive Impedance and Simultaneous Switching Noise by Using Embedded Film Capacitor

Kim, Hyungsoo; Jeong, Youchul; Park, Jongbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.129 - 132, IEEE, 2003-10-27

22713
Compensation of ESD and Input Capacitance Effect by Using Package Bond-wire Inductance for Over Gbps Differential SerDes Devices

Ahn, Seungyoung; Park, Jongbae; Chung, Daehyun; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.159 - 162, IEEE, 2003-10-27

22714
Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.199 - 202, IEEE, 2003-10-27

22715
Open Load Backward Matching (OLBM) Technique for Low ISI Differential H-tree Clock and Data Transmission

Chung, Daehyun; Baek, Seungyong; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.269 - 272, IEEE, 2003-10-27

22716
Overview of Power/Ground Effect on Data Eye and Clock Jitter; from Board Resonance to Substrate Coupling

Chung, Daehyun; Kim, Hyungsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.30 - 32, IEEE, 2003-12-12

22717
Effect of EBG structures for reducing noise in multi-layer PCBs for digital systems

Chung, D.; Kim, T.H.; Ryu, C.; Engin, E.; Swaminathan, M.; Kim, Joungho, IEEE 15th Topical Meeting on Electrical Performance of Electronic Packaging, pp.253 - 256, IEEE, 2006-10-23

22718
Suppressed carrier clock for reduction of electromagnetic radiated emission from high-speed digital system

Kam, D.G.; Kim, Joungho; Kim, J.; Jun, P., 2003 IEEE Symposium on Electromagnetic Compatibility, pp.394 - 397, IEEE, 2003-08-18

22719
High dielectric constant thin film embedded capacitor for suppression of simultaneous switching noise and radiated emission

Kim, H.; Park, H.; Jeong, Y.; Kim, Joungho; Lee, Kyu S.; Hong, Kuk J.; Hong, Y., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.588 - 591, 2004-08-09

22720
Implementation of low jitter clock distribution using chip-package hybrid interconnection

Ryu, C.; Chung, D.; Bae, K.; Yu, J.; Kim, Joungho, IEEE 13th Topical Meeting on Electrical Performance of Electronic Packaging, pp.291 - 294, IEEE, 2004-10-25

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