Significant Reduction of Power/Ground Inductive Impedance and Simultaneous Switching Noise by Using Embedded Film Capacitor

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Publisher
IEEE
Issue Date
2003-10-27
Language
English
Citation

IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.129 - 132

URI
http://hdl.handle.net/10203/638
Appears in Collection
EE-Conference Papers(학술회의논문)
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