EE-Conference Papers(학술회의논문)

Recent Items

Collection's Items (Sorted by Submit Date in Descending order): 21641 to 21660 of 22914

21641
A Fast, Accurate and Reliable Estimation for Rapid Design Space Exploration of Superscalar Architecture

Kim, Tag-Gon; Jee, Seung Bae; Kim, Yeong Geol, Int. Sym. on Performance Evaluation of Computer and Telecom Systems 2003, pp.582 - 592, Int. Sym. on Performance Evaluation of Computer and Telecom Systems, 2003-07

21642
Fuzzy-DEVS 형식론을 이용한 이산사건 시스템의 Timing 해석

권이완; 김탁곤, 한국시뮬레이션 학회 추계학술대회, pp.15 - 20, 한국시뮬레이션학회, 1997-11

21643
Parametric Behavior Modeling Framework for War Game Models Development Using OO Co-Modeling Methodology

Kim, Jae-Hyun; Kim, Tag-Gon, 2006 Sping Simulation MultiConf., pp.69 - 75, ACM, 2006-04

21644
Variable Structure Control System Design Guaranteeing Continuity of Control Signal

Park, K.B.; Lee, Ju-Jang, 제어로봇시스템학회 1996년도 Proceedings of the Korea Automatic Control Conference, 11th (KACC), pp.16 - 19, 한국제어로봇시스템학회, 1996-10

21645
A Reference-Free Debonding Monitoring Technique in CFRP Strengthened RC Structures Using Active Sensing Materials

Kim, Seong-Dae; In, CW; Cronin, KE, The 23rd Annual International Bridge Conference, 2006

21646
Distributed Optimistic Simulation of Hierarchical DEVS Models

Kim, Ki Hyung; Seong, Yeong Rak; Kim, Tag-Gon; Park, Kyu Ho, SCSC'95, pp.32 - 37, Society for Computer Simulation International, 1995-07

21647
Real-time DEVS simulation: Concurrent, time-selective execution of combined RT-DEVS model and interactive environment

Cho, Seong Myun; Kim, Tag-Gon, SCSC-98, pp.410 - 415, SCSC, 1998-07

21648
관계대수를 이용한 이산사건 시스템 모델링

홍기정; 김탁곤, 한국 시뮬레이션 학회, pp.237 - 241, 한국시뮬레이션학회, 1999-04

21649
U-City를 위한 로봇과 사용자의 실내외 연속 위치 인식 시스템

전해민; 이승목; 명현, KACC 2009, pp.342 - 345, ICROS, 2009-09-02

21650
신속한 ASIP 성능 평가를 위한 재적응성을 갖는 컴파일러/시뮬레이터 프레임웍

오세종; 김호영; 김탁곤, 한국시뮬레이션학회 2003년 춘계학술대회, pp.79 - 84, 한국시뮬레이션학회, 2003-06

21651
Verification of the DEVS Model Implementation using Aspect Embedded DEVS

Byun, Jong Hyuk; Choi, Chang Beom; Kim, Tag-Gon, 2009 Sping Simulation MultiConference, 2009 Sping Simulation MultiConf, 2009-03

21652
Development and evaluation of 3-D SiP with vertically interconnected Through Silicon Vias (TSV)

Jang, DM; Ryu, C; Lee, KY; Cho, BH; Kim, Joungho; Oh, TS; Lee, Won-Jong; et al, 57th Electronic Components and Technology Conference 2007, ECTC '07, pp.847 - 852, IEEE, 2007-05-29

21653
Sharing power distribution networks for enhanced power integrity by using through-silicon-via

Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10

21654
An adaptive reference frame selection method for multiple reference frame motion estimation in the H.264/AVC

Jeon, D.; Park, HyunWook, 2009 IEEE International Conference on Image Processing, ICIP 2009, pp.629 - 632, IEEE, 2009-11-07

21655
A 2-dimensional distributed equivalent circuit model of EBG power distribution network

Lee, Junho; Jeong, Youchul; Kim, Joungho, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005, pp.115 - 118, IEEE, 2005-10-24

21656
10Gbps backplane design methodology with sensitivity analysis and statistical analysis

Kim, J.; Baek, S.; Park, H.; Kim, S.; Hong, Y.; Lim, D.; Kim, Joungho, 7th Electronics Packaging Technology Conference, EPTC 2005, pp.38 - 42, IEEE, 2005-12-07

21657
Causality enforcement in transient simulation of HDMI interconnects with magnitude equalization

Song, Eakhwan; Cho, Jeonghyeon; Kim, Joungho; Kam, Dong Gun, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 4, IEEE, 2007-07-09

21658
High frequency electrical model of through wafer via for 3-D stacked chip packaging

Ryu, C.; Lee, J.; Lee, H.; Lee, K.; Oh, T.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.215 - 220, IEEE, 2006-09-05

21659
Dynamic power saving mechanism for mobile station in the IEEE 802.16e systems

Kwon, Sang Wook; Cho, Dong-Ho, VTC Spring 2009 - IEEE 69th Vehicular Technology Conference, IEEE, 2009-04-26

21660
Jitter suppressed on-chip clock distribution using package plane cavity resonance

Lee, W.; Ryu, C.; Park, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.427 - 430, IEEE, 2008-05-19

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