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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Sharing power distribution networks for enhanced power integrity by using through-silicon-via

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Pak, J.S. / Kim, Jounghoresearcher / Lee, J. / Lee, H. / Park, K. / Kim, J.
Publisher
IEEE
Issue Date
2008-12-10
Language
English
Citation

2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12

URI
http://hdl.handle.net/10203/18888
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EE-Conference Papers(학술회의논문)
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