Search
Results 1-10 of 23 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A Delay Line Circuit Design For Crosstalk Minimization Using Genetic Algorithm Kim, Joungho; Chung, Chaeho; Lee, Soobum; Kwak, Byungman; Kim, Gawon, China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems, pp.551 - 556, 2006 | |
| Improved Noise Isolation Design of UHF Mobile RFID Reader SiP Kim, Joungho; Shim, Yujeong, EPTC, 2006 | |
| Fast and Efficient Method for Impedance of System Power/Ground Network Including Package-Board Structure Kim, Joungho; Kim, Jaemin; Jeong, Yucheol, 8th VLSI Packaging Workshop, pp.31 - 34, 2006-12 | |
| 확장성을 가진 LTCC 기반의 Capacitor 모델 Kim, Joungho; Park, JB; Ryu, C; Shim, Y; Kim, Y; Lu, A.C.W.; Fan, W; Wai, L.L., 한국군사과학기술학회 2006년 종합학술대회, 2006 | |
| High Speed and Low Noise Packaging Design Methodologies for 40 Gbps SerDes Channel with PBGA Type Package Kam, DG; Yu, J; Choi, H; Bae, K; Kim, J; Jeong, D.-K; Lee, C; Kim, Joungho, PIERS2006 conference, pp.128 - 128, PIERS, 2006-03-26 | |
| Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation Kim, J.; Jeong, Y.; Kim, J.; Lee, J.; Shim, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.16 - 19, IEEE, 2006-08-14 | |
| Fabrication and evaluation of 3D packages with through hole via Jang, D.M.; Lee, K.Y.; Ryu, C.H.; Cho, B.H.; Oh, T.S.; Kim, Joungho; Lee, W.J.; Yu, J., 2006 MRS Fall Meeting, pp.171 - 178, 123, 2006-11-27 | |
| High frequency electrical model of through wafer via for 3-D stacked chip packaging Ryu, C.; Lee, J.; Lee, H.; Lee, K.; Oh, T.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.215 - 220, IEEE, 2006-09-05 | |
| Modeling and simulation of IC and package power/ground network Park, H.; Gam, D.G.; Kim, Joungho; Kim, H., 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.696 - 701, IEEE, 2006-08-14 | |
| Partial EBG power distribution network using remants of signal layers in multi-layer PCB Lee, Junho; Kim, Youngwon; Song, Eakhwan; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.43 - 46, IEEE, 2006-08-14 |
Discover