Modeling and simulation of IC and package power/ground network

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Publisher
IEEE
Issue Date
2006-08-14
Language
English
Citation

2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.696 - 701

URI
http://hdl.handle.net/10203/18670
Appears in Collection
EE-Conference Papers(학술회의논문)
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