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Results 191-197 of 197 (Search time: 0.004 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
191
Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Jeong, Youchul; Kim, Hyungsoo; Kim, Jingook; Park, Jongbae; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.199 - 202, IEEE, 2003-10-27

192
Prediction and Verification of Power/Ground Plane Edge Radiation Excited by Through-Hole Signal Via Based on Balanced TLM and Via Coupling Model

Pak, Jun So; Lee, Junwoo; Kim, Hyungsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.181 - 184, IEEE, 2003-10-27

193
Investigation of Plane-to-Plane Noise Coupling through Cutout in Multi-layer Power/Ground Planes

Kim, Joungho; Lee, Junwoo; Seng, Yeo Mui; Iyer, Mahadevan K, IEEE 4th Electronics Packaging Technology Conference, pp.257 - 260, IEEE, 2002-12

194
Compensation of ESD and Input Capacitance Effect by Using Package Bond-wire Inductance for Over Gbps Differential SerDes Devices

Ahn, Seungyoung; Park, Jongbae; Chung, Daehyun; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.159 - 162, IEEE, 2003-10-27

195
Significant Reduction of Power/Ground Inductive Impedance and Simultaneous Switching Noise by Using Embedded Film Capacitor

Kim, Hyungsoo; Jeong, Youchul; Park, Jongbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.129 - 132, IEEE, 2003-10-27

196
Accurate Measurement of Power/Ground Impedance with Embedded Film Capacitor using Two-port Self-Impedance Measurement Technique

Kim, Hyungsoo; Jeong, Youchul; Park, Joungbae; Lee, SeokKyu; Hong, JongKuk; Hong, Youngsoo; Kim, Joungho, IEEE 5th Electronics Packaging Technology Conference, pp.51 - 54, IEEE, 2003-12-10

197
Analytical Model of Power/Ground Noise Coupling to Signal Traces in High-speed Multi-Layer Packages or Boards

Kim, Jingook; Rotaru, Mihai Dragos; Lee, Junwoo; Park, Jongbae; Alexander, Popov; layer, Mahadevan K.; Kim, Joungho, 5th IEEE Electronics Packaging Technology Conference, pp.45 - 50, IEEE, 2003-12

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