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Results 1-10 of 17 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| The improvement of Signal Integrity (SI) according to the location of via in the vicinity of a slot in the reference plane Kim, T.H.; Lee, J.; Kim, H.; Jun, P.J.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.185 - 188, IEEE, 2002-05-12 | |
| Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board Kim, Joungho; Kim, H.; Jeong, Y.; Lee, J.; Kim, J., 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.23 - 26, 2002-05-12 | |
| Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system Kim, Joungho; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08 | |
| A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery Chung, D.; Ryu, C.; Kim, H.; Lee, C.; Kim, J.; Kim, J.; Bae, K.; Yu, J.; Lee, S.; Yoo, H.; Kim, Joungho, 2005 IEEE International Solid-State Circuits Conference, ISSCC, v.48, pp.514 - 614, 2005-02-06 | |
| Analysis of Power/Ground Network for Mixed Mode Circuits in Multi-layer PCB Kim, Joungho; Jeong, Y.; Kim, H.; Park, J.; Kim, J, 2003 Asia-Pacific Microwave Conference, 2003 | |
| High dielectric constant thin film embedded capacitor for suppression of simultaneous switching noise and radiated emission Kim, H.; Park, H.; Jeong, Y.; Kim, Joungho; Lee, Kyu S.; Hong, Kuk J.; Hong, Y., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.588 - 591, 2004-08-09 | |
| Modeling and simulation of IC and package power/ground network Park, H.; Gam, D.G.; Kim, Joungho; Kim, H., 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.696 - 701, IEEE, 2006-08-14 | |
| Characterization of SSN coupling to signal via in multi-layer PCBs and packages Park, J.; Kim, H.; Pak, J.S.; Kim, Joungho, 17th International Zurich Symposium on Electromagnetic Compatibility, 2006, pp.328 - 331, IEEE, 2006-02-27 | |
| PCB power/ground plane edge radiation excited by high-frequency clock Pak, J.S.; Kim, H.; Kim, Joungho; Lee, H., 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.197 - 202, IEEE, 2004-08-09 | |
| Co-modeling and co-simulation of package and on-chip decoupling capacitor for resonant free power/ground network design Park, H.; Kim, H.; Kam, D.G.; Kim, Joungho, 55th Electronic Components and Technology Conference, ECTC, pp.727 - 731, IEEE, 2005-05-31 |