Characterization of SSN coupling to signal via in multi-layer PCBs and packages
- Publisher
- IEEE
- Issue Date
- 2006-02-27
- Language
- English
- Citation
17th International Zurich Symposium on Electromagnetic Compatibility, 2006, pp.328 - 331
- ISSN
- 0018-9375
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
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