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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Characterization of SSN coupling to signal via in multi-layer PCBs and packages

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dc.contributor.authorPark, J.ko
dc.contributor.authorKim, H.ko
dc.contributor.authorPak, J.S.ko
dc.contributor.authorKim, Jounghoko
dc.date.accessioned2010-05-31T06:02:47Z-
dc.date.available2010-05-31T06:02:47Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-02-27-
dc.identifier.citation17th International Zurich Symposium on Electromagnetic Compatibility, 2006, pp.328 - 331-
dc.identifier.issn0018-9375-
dc.identifier.urihttp://hdl.handle.net/10203/18671-
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherIEEE-
dc.titleCharacterization of SSN coupling to signal via in multi-layer PCBs and packages-
dc.typeConference-
dc.identifier.wosid000244386300084-
dc.identifier.scopusid2-s2.0-33751044126-
dc.type.rimsCONF-
dc.citation.beginningpage328-
dc.citation.endingpage331-
dc.citation.publicationname17th International Zurich Symposium on Electromagnetic Compatibility, 2006-
dc.identifier.conferencecountrySI-
dc.identifier.conferencelocationSingapore-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorPark, J.-
dc.contributor.nonIdAuthorKim, H.-
dc.contributor.nonIdAuthorPak, J.S.-
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EE-Conference Papers(학술회의논문)
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