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Results 11-20 of 23 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Construction of integrated simulator for developing head/eye tracking system Kim, Joungho; Lee, D.-W.; Park, C.G.; Bang, H.-C.; Kim, J.-H.; Cho, S.-Y.; Kim, Y.-I.; Baek, K.-Y., 2008 International Conference on Control, Automation and Systems, ICCAS 2008, pp.2485 - 2488, 2008-10-14 | |
| Quarter-Circle Shaped Plane Cavity Resonator for Skew-Free and Low Jitter Clock Distribution Network Kim, Joungho; Lee, Woojin; Ryu, Chunghyun; Park, Jongbae, Presented at Proceeding of XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 | |
| An estimation method of chip level power distribution network inductance using full wave simulation and segmentation method Kim, J.; Shim, J.; Lee, W.; Pak, J.S.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.339 - 342, 2008-05-19 | |
| Modeling and experimental verification to investigate the effect of power supply noise imbalance on 900MHz differential LNA Koo, K.; Shim, J.; Shim, Y.; Kim, Joungho, 12th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.343 - 346, IEEE, 2008-05-12 | |
| A frequency tunable resonant clock distribution scheme using bond-wire inductor Lee, W.; Pak, J.S.; Pak, J.; Ryu, C.; Park, J.; Kim, Joungho, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.24 - 26, IEEE, 2008-12-10 | |
| Effect of power supply imbalance on nf of CMOS low noise amplifier for UHF RFID applications Koo, K.; Shim, J.; Park, H.; Kim, Joungho, Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.431 - 434, 123, 2008-05-19 | |
| Jitter suppressed on-chip clock distribution using package plane cavity resonance Lee, W.; Ryu, C.; Park, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.427 - 430, IEEE, 2008-05-19 | |
| Sharing power distribution networks for enhanced power integrity by using through-silicon-via Pak, J.S.; Kim, Joungho; Lee, J.; Lee, H.; Park, K.; Kim, J., 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.9 - 12, IEEE, 2008-12-10 | |
| Mode-impedance method for modeling and analysis of crosstalk in differential meander delay lines Kim, G.; Kim, J.; Lee, S.; Kim, J.; Kim, Joungho, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.93 - 96, IEEE, 2008-12-10 | |
| Wideband low power distribution network impedance of high chip density package using 3-D stacked through silicon vias Pak, J.S.; Ryu, C.; Kim, J.; Shim, Y.; Kim, G.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.351 - 354, IEEE, 2008-05-19 |
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