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Results 1-10 of 30 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Eye-width and Eye-height Estimation Method based on Artificial Neural Network (ANN) for USB 3.0 Lho, Daehwan; Park, Junyong; Park, Hyunwook; Kang, Hyungmin; Park, Shinyoung; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.209 - 211, IEEE, 2018-10-15 | |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 | |
| Convolutional Neural Network-based Fast and Accurate Irregular Shape Power/Ground Plane Impedance Estimation Method for High-Speed Signaling Kim, Keunwoo; Lho, Daehwan; Park, Hyunwook; Son, Keeyoung; Kim, Seongguk; Park, Shinyoung; Sim, Boogyo; Kim, Subin; Kim, Joungho, IEEE-MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), IEEE, 2020-12 | |
| A Processing-In-Memory on High Bandwidth Memory (PIM-HBM): Impact of interconnect Channels on System Performance in 2.5D/3D IC Park, Hyunwook; Kim, Joungho; Shin, TaeIn; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang, DesignCon 2022, IEEE, 2022-04-05 | |
| Deterministic Policy-based Reinforcement Learning Method for Optimization method Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, BooGyo; Son, Kyungjune; Son, Keeyoung; Park, Joonsang; Kim, Haeyeon, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 | |
| Crosstalk-included PAM-4 Worst Eye Diagram Estimation Method for High-speed Serial Links Park, Hyunwook; Kim, Joungho; Kim, Keunwoo; Sim, BooGyo; Lho, Daehwan; Shin, TaeIn; Son, Keeyoung; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; Kang, Hyungmin; Kim, SeongGuk; Shin, TaeIn; Kim, Keunwoo; Son, Keeyoung, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Signal Integrity Analysis of High Speed Channel considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Park, Hyunwook; Park, Gap Yeol, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics Park, Hyunwook; Kim, Joungho; Park, Joonsang; Park, Gap Yeol; Lho, Daehwan; Sim, BooGyo; Kang, Hyungmin; Shin, TaeIn; Kim, SeongGuk; Choi, Seonguk, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 | |
| Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM) Kim, SeongGuk; Kim, Joungho; Shin, TaeIn; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang; Choi, Seonguk; Kim, Haeyeon, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |