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A Processing-In-Memory on High Bandwidth Memory (PIM-HBM): Impact of interconnect Channels on System Performance in 2.5D/3D IC

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Park, Hyunwook / Kim, Jounghoresearcher / Shin, TaeIn / Lho, Daehwan / Son, Keeyoung / Kim, Keunwoo / Park, Joonsang
Publisher
IEEE
Issue Date
2022-04-05
Citation

DesignCon 2022

URI
http://hdl.handle.net/10203/304676
Appears in Collection
EE-Conference Papers(학술회의논문)
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