Prediction of Wiggling Phenomenon in High Aspect Ratio Thin Film Structure During Etching Process through Buckling-Based Dimensional Analysis

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Publisher
The Korean Microelectronics and Packaging Society
Issue Date
2023-10-27
Language
English
Citation

The 21st International Symposium on Microelectronics and Packaging (ISMP)

URI
http://hdl.handle.net/10203/317413
Appears in Collection
ME-Conference Papers(학술회의논문)
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