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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Silicon Wafer’s Non-destructive Measurement and Interface Inspection System based on Optical Third Harmonic Generation

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Lee, In Jae / Kim, Dae Hee / Hahm, Jiwon / Yoo, Hongki / Kim, Seung-Wooresearcher / KIM, Young-Jinresearcher
Publisher
ISMNM
Issue Date
2023-07-12
Language
English
Citation

1st International Symposium on Micro and Nano Manufacturing, ISMNM 2023

URI
http://hdl.handle.net/10203/316380
Appears in Collection
ME-Conference Papers(학술회의논문)
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