Silicon Wafer’s Non-destructive Measurement and Interface Inspection System based on Optical Third Harmonic Generation

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dc.contributor.authorLee, In Jaeko
dc.contributor.authorKim, Dae Heeko
dc.contributor.authorHahm, Jiwonko
dc.contributor.authorYoo, Hongkiko
dc.contributor.authorKim, Seung-Wooko
dc.contributor.authorKIM, Young-Jinko
dc.date.accessioned2023-12-13T06:01:15Z-
dc.date.available2023-12-13T06:01:15Z-
dc.date.created2023-11-24-
dc.date.issued2023-07-12-
dc.identifier.citation1st International Symposium on Micro and Nano Manufacturing, ISMNM 2023-
dc.identifier.urihttp://hdl.handle.net/10203/316380-
dc.languageEnglish-
dc.publisherISMNM-
dc.titleSilicon Wafer’s Non-destructive Measurement and Interface Inspection System based on Optical Third Harmonic Generation-
dc.typeConference-
dc.type.rimsCONF-
dc.citation.publicationname1st International Symposium on Micro and Nano Manufacturing, ISMNM 2023-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationSt. John's Hotel, Gangneung-
dc.contributor.localauthorKim, Seung-Woo-
dc.contributor.localauthorKIM, Young-Jin-
dc.contributor.nonIdAuthorLee, In Jae-
dc.contributor.nonIdAuthorKim, Dae Hee-
dc.contributor.nonIdAuthorHahm, Jiwon-
dc.contributor.nonIdAuthorYoo, Hongki-
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ME-Conference Papers(학술회의논문)
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