Design and analysis of signal and power integrity for multi-layer scramble PCB connecting different types of packages

Abstract

In order to evaluate dozens of types of multi-package types of mobile DRAM, a scramble circuit board that connects the package types between the DRAM and the processor is required. To improve the signal integrity and power integrity of the scrambled circuit board, it can be solved by changing the material, but it is not a sensible answer in terms of cost. Therefore, in this thesis, we will investigate how to improve the signal integrity and power integrity of the scrambled circuit board, propose and verify the combination method of the signal and power layer applied with the improvement plan.