The measurement of residual deformation in PBGA package after reflow process using a newly developed laser profiler

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Publisher
Trans Tech Publications
Issue Date
2006-09
Language
English
Citation

International Confernce on Experimental Mechanics 2006, pp.513 - 516

ISSN
1013-9826
URI
http://hdl.handle.net/10203/2958
Appears in Collection
ME-Conference Papers(학술회의논문)
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