The measurement of residual deformation in PBGA package after reflow process using a newly developed laser profiler

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dc.contributor.authorKim, Iko
dc.contributor.authorYoon, JYko
dc.contributor.authorLee, Soon-Bokko
dc.date.accessioned2008-01-28T08:12:11Z-
dc.date.available2008-01-28T08:12:11Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued2006-09-
dc.identifier.citationInternational Confernce on Experimental Mechanics 2006, pp.513 - 516-
dc.identifier.issn1013-9826-
dc.identifier.urihttp://hdl.handle.net/10203/2958-
dc.description.sponsorshipDepartment of Mechanical Engineering, Korea Advanced Institute of Science and Technology, 373-1, Guseong-dong, Yuseong-gu, Daejeon, 305-701, South Koreaen
dc.languageEnglish-
dc.language.isoen_USen
dc.publisherTrans Tech Publications-
dc.titleThe measurement of residual deformation in PBGA package after reflow process using a newly developed laser profiler-
dc.typeConference-
dc.identifier.wosid000243448200126-
dc.identifier.scopusid2-s2.0-33751501052-
dc.type.rimsCONF-
dc.citation.beginningpage513-
dc.citation.endingpage516-
dc.citation.publicationnameInternational Confernce on Experimental Mechanics 2006-
dc.identifier.conferencecountryKO-
dc.identifier.conferencelocationJeju-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorKim, I-
dc.contributor.nonIdAuthorYoon, JY-
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ME-Conference Papers(학술회의논문)
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