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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

칩 패키지의 휨 해석을 위한 유리 섬유 강화 플라스틱 기판의 3층 구조 모델링

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김준모 / 조우성 / 이태익 / 김택수researcher
Publisher
한국마이크로전자 및 패키징 학회
Issue Date
2019-04-11
Language
Korean
Citation

한국마이크로전자 및 패키징 학회 2019년도 춘계 정기학술대회

URI
http://hdl.handle.net/10203/263098
Appears in Collection
ME-Conference Papers(학술회의논문)
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