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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics

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Kim, S. / Kim, Taek-Sooresearcher
Publisher
Advanced Packaging & System Technology
Issue Date
2012-11-22
Language
English
Citation

International Workshop on Advanced Packaging & System Technology

URI
http://hdl.handle.net/10203/259240
Appears in Collection
ME-Conference Papers(학술회의논문)
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