DSpace at KOASAS: Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM)

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Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM)

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Kim, Joungho researcher / Cho, Kyungjun / Lee, Hyunsuk / Park, Gapyeol / Kim, Subin / Son, Kyungjune / Choi, Sumin

Publisher: 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

Issue Date: 2017-12-16

Language: English

Citation: 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)

URI: http://hdl.handle.net/10203/248943

Appears in Collection: EE-Conference Papers(학술회의논문)

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Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM)

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