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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Signal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM)

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dc.contributor.authorKim, Jounghoko
dc.contributor.authorCho, Kyungjunko
dc.contributor.authorLee, Hyunsukko
dc.contributor.authorPark, Gapyeolko
dc.contributor.authorKim, Subinko
dc.contributor.authorSon, Kyungjuneko
dc.contributor.authorChoi, Suminko
dc.date.accessioned2019-01-22T08:15:38Z-
dc.date.available2019-01-22T08:15:38Z-
dc.date.created2018-12-26-
dc.date.created2018-12-26-
dc.date.created2018-12-26-
dc.date.issued2017-12-16-
dc.identifier.citation2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)-
dc.identifier.urihttp://hdl.handle.net/10203/248943-
dc.languageEnglish-
dc.publisher2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)-
dc.titleSignal and Power Integrity (SI/PI) Analysis of Heterogeneous Integration Using Embedded Multi-die Interconnect Bridge (EMIB) Technology for High Bandwidth Memory (HBM)-
dc.typeConference-
dc.identifier.wosid000428157200148-
dc.identifier.scopusid2-s2.0-85050487250-
dc.type.rimsCONF-
dc.citation.publicationname2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)-
dc.identifier.conferencecountryCC-
dc.identifier.conferencelocationHangzhou, China-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorCho, Kyungjun-
dc.contributor.nonIdAuthorLee, Hyunsuk-
dc.contributor.nonIdAuthorPark, Gapyeol-
dc.contributor.nonIdAuthorKim, Subin-
dc.contributor.nonIdAuthorSon, Kyungjune-
dc.contributor.nonIdAuthorChoi, Sumin-
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EE-Conference Papers(학술회의논문)
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