Hygrothermal analysis for the electrochemical migration failure in multi-chip packages during a highly accelerated stress test
- Publisher
- EMAP 2012
- Issue Date
- 2012-12-15
- Language
- English
- Citation
EMAP 2012
- Appears in Collection
- ME-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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