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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Hygrothermal analysis for the electrochemical migration failure in multi-chip packages during a highly accelerated stress test

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dc.contributor.authorLee, Soon-Bokko
dc.contributor.authorJang, Jae-wonko
dc.contributor.authorKim, Nam-seogko
dc.date.accessioned2018-12-20T02:21:13Z-
dc.date.available2018-12-20T02:21:13Z-
dc.date.created2014-01-14-
dc.date.created2014-01-14-
dc.date.created2014-01-14-
dc.date.issued2012-12-15-
dc.identifier.citationEMAP 2012-
dc.identifier.urihttp://hdl.handle.net/10203/247586-
dc.languageEnglish-
dc.publisherEMAP 2012-
dc.titleHygrothermal analysis for the electrochemical migration failure in multi-chip packages during a highly accelerated stress test-
dc.typeConference-
dc.identifier.wosid000321950300043-
dc.identifier.scopusid2-s2.0-84880270260-
dc.type.rimsCONF-
dc.citation.publicationnameEMAP 2012-
dc.identifier.conferencecountryHK-
dc.identifier.conferencelocation홍콩-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorJang, Jae-won-
dc.contributor.nonIdAuthorKim, Nam-seog-
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ME-Conference Papers(학술회의논문)
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