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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

FOWLP 적용을 위한 플라즈마 전처리에 따른 절연층과 Cu RDL 계면 접착력 측정 및 분석

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김가희 / 이진아 / 박세훈 / 강수민 / 김택수researcher / 박영배
Publisher
한국반도체연구조합
Issue Date
2018-02-07
Language
Korean
Citation

제25회 한국반도체학술대회

URI
http://hdl.handle.net/10203/244185
Appears in Collection
ME-Conference Papers(학술회의논문)
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