Showing results 1 to 6 of 6
3-D construction of monolithic passive components for RF and microwave ICs using thick-metal surface micromachining technology Yoon, Jun-Bo; Kim, BI; Choi, YS; Yoon, E, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.51, no.1, pp.279 - 288, 2003-01 |
A STUDY OF LATTICE DAMAGE IN SILICON INDUCED BY BF2+ ION-IMPLANTATION PAEK, MC; KWON, OJ; Lee, JeongYong; Lim, Ho Bin, JOURNAL OF APPLIED PHYSICS, v.70, no.8, pp.4176 - 4180, 1991-10 |
CMOS-compatible surface-micromachined suspended-spiral inductors for multi-GHz silicon RF ICs Yoon, Jun-Bo; Choi, YS; Kim, BI; Eo, Y; Yoon, E, IEEE ELECTRON DEVICE LETTERS, v.23, no.10, pp.591 - 593, 2002-10 |
EFFECTS OF ANNEALING CONDITIONS ON THE PROPERTIES OF TANTALUM OXIDE-FILMS ON SILICON SUBSTRATES PARK, SW; BAEK, YK; Park, Chong-Ook; PARK, CO; Lim, Ho Bin, JOURNAL OF ELECTRONIC MATERIALS, v.21, no.6, pp.635 - 639, 1992-06 |
Fabrication of superconducting MgB2 thin films on textured Cu(100) tape by hybrid physical-chemical vapor deposition Lee T.G.; Ranot M.; Seong W.K.; Jung S.-G.; Kang W.N.; Joo J.H.; Kim C.-J.; et al, SUPERCONDUCTOR SCIENCE & TECHNOLOGY, v.22, no.4, 2009 |
Initial stage of nitridation on Si(100) surface using low-energy nitrogen ion implantation Kim K.-j.; Kang T.-H.; Ihm K.; Jeon C.; Hwang C.-C.; Kim B., SURFACE SCIENCE, v.600, no.17, pp.3496 - 3501, 2006 |
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