141 | 도포된 이방성 전도 접착제를 이용한 웨이퍼형 플립 칩 패키지 제조방법 임명진; 백경욱 |
142 | 고부피분율 SiC분말함유 예비성형체의 제조장치 및 제조방법 홍순형; 이효수; 전경윤 |
143 | Verfahren zur Herstellung von Lithium-Mangan-Oxid-Pulvern für Lithium-Sedundärbatterien Kim, Ho-Gi; Han, Yi Sup |
144 | 입자크기가큰다결정규소박막의제조방법 임호빈; 안병태; 문대규; 이정노 |
145 | FE-MN-AL계 극저온 구조용 합금 홍순형; 한영수 |
146 | BaTiO3系誘電体の製造方法 이병기; 정양일; 이호용; 강석중; 정성윤 |
147 | 表面改質されたアルミナセラミックスとその製造方法 강석중; 이영우; 이호용 |
148 | Transparent composite compound Bae, Byeong-Soo; Jin, Jungho; Yang, Seung Cheol; Ko, Ji Hoon |
149 | 内蔵型キャパシター用ポリマー/セラミック複合ペースト及びこれを利用したキャパシターの製造方法 백경욱; 장경운; 조성동 |
150 | Method for manufacturing conductive adhesive for high frequency flip chip package applications Paik, Kyung-Wook; Yim, Myung jin; Kwon, Woon Seong |
151 | Method of fabricating multilayered UBM for flip chip interconnections by electroplating Kim, Su Hyeon; Kim, Jong Yeon; Yu, Jin |
152 | Method for preparing heteroepitaxial thin film Chung, Sung Yoon; Kim, Suk Pil; Kang, Byung Sung; Choi, Si-Kyung; Kang, Suk-Joong L |
153 | Method of manufacturing lithium-manganese oxide for use in lithium secondary battery Han, Yi Sup; Kim, Ho-Gi; Park, Kyu Sung |
154 | High dielectric ceramic composition Kim, Ho-Gi; Park, Yung; Knowles, Kevin |
155 | High dielectric ceramic capacitor composition Kim, Ho-Gi; Park, Yung; Knowles, Kevin |
156 | Process for preparing a preform with high volume fraction SiC Hong, Soon Hyung; Lee, Hyo Soo; Jeon, Kyung Yoon |
157 | High efficiency heating resistor comprising an oxide, liquid ejecting head and apparatus using the same Kang, Sang-Won; Kwon, Se-Hun |
158 | Method for forming SBT ferroelectric thin film Kim, Ho-Gi; Lee, Won Jae; Yoon, Soon Gil; Ahn, Joon Hyung |
159 | Microwave dielectric ceramic composition Kim, Ho-Gi; Park, Yung |
160 | Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method Paik, Kyung-Wook; Nah, Jae Woong; Jeon, Young Doo; Yim, Myung Jin |