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Showing results 115 to 134 of 1245

115	Magnetic device with gate electrode Park, Byong-Guk; Kang, Min-Gu; Choi, Jong-Guk
116	Magnetic logic device Park, Byong-Guk; Kim, Kab-Jin; Lee, Geun-hee
117	MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE Lee, Keon Jae; Lee, Sangyong
118	MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE Lee, Keon Jae; Lee, Sangyong
119	MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE Lee, Keon Jae; Lee, Sangyong
120	MANUFACTURING METHOD FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SOLAR CELL, AND LIGHT EMITTING DEVICE Lee, Keon Jae; Lee, Sangyong
121	Member for gas sensor, having a metal oxide semiconductor tube wall with micropores and macropores, gas sensor, and method for manufacturing same Kim, Il-Doo; Jang, Ji Su; Kim, Sang-Joon; Choi, Seon-Jin, 2019-04-30
122	Member for gas sensor, having a metal oxide semiconductor tube wall with micropores and macropores, gas sensor, and method for manufacturing same Kim, Il-Doo; Ji Su Jang; Kim, Sang-Joon; Choi, Seon-Jin
123	METHOD AND APPARATUS FOR MULTIPLEXED IMAGING OF BIOMOLECULES THROUGH ITERATIVE UNMIXING OF FLUOROPHORE SIGNALS Chang, Jae-Byum; Yoon, Young-Gyu; Seo, Junyoung; Sim, Yeonbo; Kim, Jee Won
124	Method and apparatus for multiplexed imaging of spectrally-similar fluorophores Chang, Jae-Byum; Yoon, Young-Gyu; Seo, Junyoung; Sim, Yeonbo
125	Method for bonding between electrical devices using ultrasonic vibration Paik, Kyung-Wook; Yim, Myung-jin; Kim, Hyoung-joon; Lee, Ki-won
126	Method for fabricating carbon nanotube-metal-polymer nanocomposites 홍순형, 2011-09-07
127	Method for fabricating chip size packages using lamination process Paik, Kyung-Wook; Jang, Se Young
128	Method for fabricating epitaxial cobalt-disilicide layers using cobalt-nitride thin film 안병태, 2006-09-12
129	Method for fabricating wafer-level flip chip package using pre-coated anisotropic conductive adhesive 백경욱, 2003-02-11
130	Method for forming flip chip bump and UBM for high speed copper interconnect chip using electroless plating method Paik, Kyung-Wook; Nah, Jae Woong; Jeon, Young Doo; Yim, Myung Jin
131	Method for forming SBT ferroelectric thin film Kim, Ho-Gi; Lee, Won Jae; Yoon, Soon Gil; Ahn, Joon Hyung
132	Method for Making Barium Titanate Dielectrics Kang, Suk-Joong L; Lee, Byung Ke; Lee, Ho Yong; Chung, Sung Yoon, 2001-09-20
133	Method for making BaTiO3-based dielectric 강석중, 2002-03-19
134	Method for making n-type semiconductor diamond Yu, Jin; Lee, Woong Sun; Kim, Jung Keun, 2000-08-01

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