DSpace at KOASAS: Browsing DSpace

DSpace at KOASAS

Browsing DSpace

Browse "School of Electrical Engineering(전기및전자공학부)" by Author Fan, Jun

Sort by:
In order:
Results/Page
Authors/Record:

Showing results 1 to 9 of 9

1	Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis Piersanti, Stefano; Pellegrino, Enza; de Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Dong-Hyun; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1329 - 1338, 2017-08
2	Analytical Expressions of Differential-mode Harmonics in Loosely-coupled Series-resonant Wireless Power Transfer System Kim, Hongseok; Fan, Jun; Lee, Seongsoo; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.648 - 653, Institute of Electrical and Electronics Engineers Inc., 2019-07
3	Design of On-Chip Linear Voltage Regulator ModuleAnd Measurement of Power Distribution NetworkNoise Fluctuation at High-Speed Output Buffer Lee, Man Ho; Kim, Hee Gon; Kim, Suk Jin; Kim, Joung Ho; Cho, Jong Hyun; Yoon, Chang Wook; Achkir, Brice; et al, 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 24rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2015-10-25
4	Detection of open and short faults in 3D-ICs based on through silicon via (TSV) Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Joungho; Fan, Jun, IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017, pp.405 - 410, Institute of Electrical and Electronics Engineers Inc., 2017-08
5	Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays Kim, Jingook; Shringarpure, Ketan; Fan, Jun; Kim, Joungho; Drewniak, James L., IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.21, no.2, pp.62 - 64, 2011-02
6	Equivalent Circuit Modeling of Dielectric Hysteresis Loops in Through Silicon Vias Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Kim, Dong-Hyun; Kim, Joungho; Fan, Jun, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.6, pp.1510 - 1516, 2015-12
7	Extraction of the parameters of the coupling capacitance hysteresis cycle for TSV transient modeling Piersanti, S; Pellegrino, E; De Paulis, F; Orlandi, A; Kim, Joungho; Fan, Jun, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.406 - 411, Institute of Electrical and Electronics Engineers Inc., 2016-07
8	Guest Editorial: Introduction to the Special Issue on EMC for Wireless Power Transfer and Power Electronics Fan, Jun; Carvalho, Nuno Borges; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.61, no.6, pp.1902 - 1903, 2019-12
9	Inductance Calculations for Plane-Pair Area Fills With Vias in a Power Distribution Network Using a Cavity Model and Partial Inductances Kim, Jingook; Fan, Jun; Ruehli, Albert E.; Kim, Joungho; Drewniak, James L., IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.59, no.8, pp.1909 - 1924, 2011-08

Discover

KOASAS

Knowledge Service Development Team, KAIST 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea. T. 82-42-350-4493 Email. koasas@kaist.ac.kr
Copyright © 2016. Korea Advanced Institute of Science and Technology. All Rights Reserved.

Communities & Collections

rss_1.0 rss_2.0 atom_1.0