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Browse "School of Electrical Engineering(전기및전자공학부)" by Subject Silicon

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Showing results 13 to 19 of 19

13	Performance Boost of Si TFETs by Insertion of III-V Dipole Formation Layer: A First Principle Study Lim, Yeongjun; Seo, Junbeom; Shin, Mincheol, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.70, no.6, pp.2956 - 2961, 2023-06
14	Self-Heating Effects in 3-D Vertical-NAND (V-NAND) Flash Memory Yun, Gyeong-Jun; Yun, Dae-Hwan; Park, Jun-Young; Kim, Seong-Yoen; Choi, Yang-Kyu, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.67, no.12, pp.5505 - 5510, 2020-12
15	Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme Kim, Seongguk; Kim, Subin; Cho, Kyungjun; Shin, Taein; Park, Hyunwook; Lho, Daehwan; Park, Shinyoung; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.11, pp.1955 - 1970, 2021-11
16	Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09
17	Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module Son, Keeyoung; Kim, Seongguk; Park, Hyunwook; Shin, Taein; Kim, Keunwoo; Kim, Minsu; Sim, Boogyo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.12, no.9, pp.1542 - 1556, 2022-09
18	Thermoelectric characteristics of Pt-silicide/silicon multi-layer structured p-type silicon Choi, Won Chul; Jun, Dongseok; Kim, Soojung; Shin, Min-Cheol; Jang, Moongyu, ENERGY, v.82, pp.180 - 183, 2015-03
19	Vertical InGaAs Biristor for Sub-1 V Operation Kim, Wu-Kang; Bidenko, Pavlo; Kim, Jongmin; Sim, Jaeho; Han, Joon-Kyu; Kim, Seongkwang; Geum, Dae-Myeong; et al, IEEE ELECTRON DEVICE LETTERS, v.42, no.5, pp.681 - 683, 2021-05

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