Browse "School of Electrical Engineering(전기및전자공학부)" by Author Yoon, C.
Showing results 7 to 12 of 12
| Modeling and measurement of board-level ESD from power/ground plane charged by low-voltage for investigation of decoupling capacitor effects in Printed Circuit Boards (PCBs) Sung, H.; Kim, M.; Lee, W.; Yoon, C.; Koo, K.; Kwon, J.; Kim, Joungho, 12th Electronics Packaging Technology Conference, EPTC 2010, pp.773 - 776, EPTC 2010, 2010-12-08 |
| Noise isolation modeling and experimental validation of power distribution network in chip-package Park, H.; Yoon, C.; Koo, K.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 |
| Packet transmission utilizing single-carrier FDE technique in a modified cdma2000 based cellular system Yoon, C.; Lee, W.Y.; Chung, H.K.; Kang, Joonhyuk, 2010 International Conference on Information and Communication Technology Convergence, ICTC 2010, pp.260 - 263, ICTC 2010, 2010-11-17 |
| Performance enhancement of F-PDCH using oversampling diversity MMSE receive equalizer Yoon, C.; Kang, Joonhyuk, 2005 IEEE 61st Vehicular Technology Conference -VTC 2005 - Spring Stockholm: Paving the Path for a Wireless Future, v.61, pp.753 - 757, 2005-05-30 |
| Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP) Yoon, C.; Kim, Joungho; Kim, J., 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
| Suppression of power/ground noise using Meshed-Planar Electromagnetic Bandgap (MP-EBG) structure for Ultra-Wideband (UWB) system-in-package (SiP) Kim, M.; Yoon, C.; Koo, K.; Hwang, C.; Sung, H.; Kim, Joungho, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.28 - 31, IEEE, 2010-07-25 |
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