Signal quality test with 3-dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)
- Issue Date
- 2009-12-02
- Language
- ENG
- Citation
2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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