Browse "School of Electrical Engineering(전기및전자공학부)" by Author 1094
Showing results 11 to 70 of 161
| A 6.4Gbps On-chip Eye Opening Monitor Circuit for Signal Integrity Analysis of High Speed Channel Kim, Joungho; Shin, Mincheol; Shim, Jongjoo; Kim, Jaemin; Pak, Jun So; Hwang, Chulsoon; Yoon, Changwook; et al, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 7, 2008-08 |
| A chip-package hybrid DLL loop and clock distribution network for low-jitter clock delivery Chung, D.; Ryu, C.; Kim, H.; Lee, C.; Kim, J.; Kim, J.; Bae, K.; et al, 2005 IEEE International Solid-State Circuits Conference, ISSCC, v.48, pp.514 - 614, 2005-02-06 |
| A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics Song, E.; Kim, J.; Kim, Joungho; Cho, J., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.165 - 168, IEEE, 2010-10-25 |
| A Delay Line Circuit Design For Crosstalk Minimization Using Genetic Algorithm Kim, Joungho; Chung, Chaeho; Lee, Soobum; Kwak, Byungman; Kim, Gawon, China-Japan-Korea Joint Symposium on Optimization of Structural and Mechanical Systems, pp.551 - 556, 2006 |
| A Delay Line Circuit Layout For Crosstalk Minimization Using Genetic Algorithm and Experimental Verification Kim, Joungho; Chung, Chaeho; Lee, Soobum; Kwak, Byungman; Kim, Gawon, World Congress on Structural and Multidisciplinary Optimization, 2007 |
| A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin Yoon, C.; Baek, S.; Lee, H.; Jeong, Y.; Park, J.; Park, H.; Sung, B.; et al, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, pp.143 - 146, 2008-10-27 |
| A Fast and Efficient Modeling Method for Chip-Package-PCB Hierarchical Power Distribution Network Kim, Joungho; Kim, Jaemin; Shim, Jongjoo; Pak, JunSo, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 |
| A Fast and Precise Analytical Eye-diagram Estimation Method for a Channel of a Pair of Differential Microstriplines on PCB with Arbitrary Terminations Kim, Joungho; Cho, Jeonghyeon; Song, Eakhwan; Shim, Jongjoo; Shim, Yujeong, Electrical Design Advanced Packaging & Systems, EDAPS 2009, 2009 |
| A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations Cho, J.; Song, E.; Shim, J.; Shim, Y.; Kim, Joungho, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
| A Frequency Clock Distribution Scheme Using Bond-Wire Inductor Kim, Joungho; Lee, Woojin; Pak, Jun So; Pak, Jiwoo; Ryu, Chunghyun; Park, Jongbae, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 |
| A Low-Cost and High-density RF Multi-chip Module Tranceiver For 1.8 GHz Personal Communication Service Kim, Joungho; Ryu, Woonghwan; Kim, Jonghoon; Kim, Namhoon; Kim, Hyungsoo; Ahn, Seungyoung; Kim, Sungil; et al, IEEE ECTC Conference, IEEE, 2000 |
| A MLGA Connector for High speed and High Density Kim, Joungho; Kim, Young Soo; Choi, Hyung Seok; Ko, Youngwoo; Bang, Hyo Jae; Kim, Woo Kyung; Baek, Seungyong; et al, HD International 2001 (The International Conference and Exhibition on High Density Interconnect and Systems packaging), 2001 |
| A New 3.0T Hybrid-Spiral-Birdcage (HSB) Coil for Improved Homigeneity Along Z-Axis Kim, Joungho; Park, Jun So; Kim, Jonghoon; Lee, Jong-O; Park, Bu-sik; Jung, Seung-Pil; Jung, Kwan-jin, International Society for Magneitc Resonance of Imaging, 2000 |
| A New Graduate Packaging Course in Electronics Course in Electronics - High-speed Digital Interconnection and Packaging Kim, Joungho, 2nd International Academic Conference on Packaging, 1999-03 |
| A Noise Coupling Effect on Reference Voltage Level of Triggering Circuit in Non-coherent UWB Communication System Kim, Joungho; Yoon, Changwook; Shin, Minchul; Shim, Yujeong; Kim, Myunghoi; Cho, Jeonghyeon, EMC Kyoto Symposium, 2009 |
| A Novel Free-Standing Absolute-Voltage Probe with 2.3 ps Resolution and 1-Microvolt Sensitivity Kim, Joungho; Williamson, S.; Nees, J.; Wakana, S., 8th International Conference on Ultrafast Phenomena, pp.496 - 496, 1992 |
| A Novel radio Frequency Clocking Scheme for Over GHz Digital Two-Phase Clock Distribution Kim, Joungho, IMAPS Advanced Technology Workshop on Next Generation IC & Package Design, 1999-07-15 |
| A Novel Time domain Picosecond Pulse Sampling System for Non-contact Characterization of Liquids Semiconductors, and Metals Kim, Joungho; Kim, Woopoung; Ryu, aeyoung; Lee, Heeseok, CLEO/Pacific Rim '99, pp.791 - 792, 1999 |
| A Novel Twisted Differential Line for High-speed On-chip Interconnections with Reduced Crosstalk Kim, Joungho; Kam, Dong Gun; Ahn, Seungyoung; Baek, Seungyong; Park, Bongcheol; Sung, Myunghee, IEEE 4th Electronics Packaging Technology Conference, pp.180 - 183, IEEE, 2002 |
| A Novel Twisted Differential Line on PCB: Crosstalk Model and Its Application to High-speed Interconnect Circuit Design Kim, Joungho; Kam, Dong Gun, IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp.153 - 156, IEEE, 2002 |
| A Precise Analytical Estimation Method of Data-dependent Jitter for High Speed Serial Links with the Consideration of Finite Slew Rate of Input Signal Cho, Jeonghyeon; Song, Eakhwan; Shim, Jongjoo; Kim, Gawon; Kim, Jiseong; Kim, Joungho, 2009 Korea-Japan Joint Conference, pp.215 - 218, 2009 |
| A Wide Range CMOS Adaptive Output Drivers for Customized Control of Signal Rise Time and Power/Ground Noise Kim, Joungho, IMAPS Advanced Technology Workshop on Next Generation IC & Package Design, 1999-07 |
| An estimation method of chip level power distribution network inductance using full wave simulation and segmentation method Kim, J.; Shim, J.; Lee, W.; Pak, J.S.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.339 - 342, 2008-05-19 |
| An evaluation of differential impedance in PCBs using two single-ended probes only Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12 |
| An On-Chip Signal Integrity Characterization Scheme for Gbps Data Transmission Channel Kim, Joungho; Cho, Jeonghyeon; Song, Eakhwan; Lee, Woojin, Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 |
| An On-Chip Spectrum Analyzer for Signal Integrity Kim, Joungho; Cho, Jeonghyeon; Lee, Woojin; Song, Eakhwan; Shim, Jongjoo; Shin, Minchul; Yoon, Changwook, EMC Kyoto Symposium, 2009 |
| An undergraduate class for high-frequency design, fabrication, and measurement Kim, Joungho; Ahn, S.; Park, B.; Chung, Y., Advances in Electronic Packaging, v.3, pp.1827 - 1830, 2001-07-08 |
| Analysis and Modeling of Delay and Crosstalk in Differential Meander Delay Line on Based on A Time Domain Mode Impedances Kim, Joungho; Kim, Gawon; Kim, Jaemin; Lee, Sangrok, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 |
| Analysis of DLL Jitter Affected by Power Supply Noise on Power Distribution Network Kim, Joungho; Shin, Minchul; Yoon, Changwook; Cho, Jeonghyeon; Shim, Jongjoo; Shim, Yujeong, EMC Kyoto Symposium, 2009 |
| Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole Lee, H.; Hong, Y.-S.; Kam, D.; Kim, Joungho, Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects, pp.31 - 34, 2004-05-09 |
| Analysis of power distribution network in TSV-based 3D-IC Kim, K.; Lee, W.; Kim, J.; Song, T.; Kim, J.; Pak, J.S.; Kim, Joungho; et al, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.177 - 180, IEEE, 2010-10-25 |
| Analysis of Power/Ground Network for Mixed Mode Circuits in Multi-layer PCB Kim, Joungho; Jeong, Y.; Kim, H.; Park, J.; Kim, J, 2003 Asia-Pacific Microwave Conference, 2003 |
| Analysis of the effect of digital power ground noise on active balun in UHF RTID SiP Park, J.; Ryu, C.; Yoon, C.; Koo, K.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.586 - 590, IEEE, 2007-12-12 |
| Application of a 3-D Field Solver for On-chip and Package Microstrip Interconnection Design Kim, Joungho; Ryu, Woonghwan; Lu, Albert; Wai, Chee; Wei, Fan, IEEE EPTC 2000, IEEE, 2000 |
| Applications of Terahertz Electronics Kim, Joungho, 1st Asian Conference on Ultrafast Phenomena, 2000-02-28 |
| Applications of Terahertz Optoelectronics 김정호, 대한전자공학회 추계종합학술대회, 대한전자공학회, 1999-11-27 |
| Balanced TLM and Coupling Model for Analysis of Power/Ground Resonance, Noise Coupling, and Edge Radiation Kim, Joungho; Pak, Jun So; Lee, Jongbae; Kim, Hyungsoo; Lee, H.J; Choi, C.S, Electromagnetic Compatibility Conference, pp.505 - 508, 2004 |
| Basic Analysis of Signal and Power Integrity of TSV Applications Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18 |
| Causal Transient Simulation of Magnitude Equalized Signal on High-speed Interconnects Kim, Joungho; Song, Eakhwan; Cho, Jeonghyeon, International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2007 |
| Characterization of >100 GHz devices using photoconductive pump and probe measurement Lee, Jaehoon; Lee, Heeseok; Kim, Woopoung; Lee, Jongjoo; Kim, Joungho, Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2), v.1, pp.225 - 226, IEEE, 1998-12-01 |
| Chip-Package-Circuit Co-modeling for Analysis of Digital Power and Ground Noise Coupling Effect on CMOS Negative Feedback Operational Amplifier Kim, Joungho; Shim, Yujeong; Park, Jongbae, EMC compo, 2007 |
| Circuital Approach to Evaluate Shielding Effectiveness of Rectangular Enclosures with Apertures on Multiple Sides Kim, Joungho; Shim, Jongjoo; Kam, Dong Gun; Kwon, Jong-Hwa, International Symposium on Electromagnetic Compatibility (EMC Europe), pp.295 - 300, 2004 |
| Compact Terahertz Imaging System Using Near-Field Probe Kim, Joungho; Ryu, J.; Kim, W.; Lee, H., 7th IEEE International Conference on Terahertz Electronics, pp.81 - 84, 1999-11 |
| Compensation of BSD and device input capacitance by using embedded inductor on PCB substrate for 3 Gbps SerDes applications Ahn, S.; Baek, S.; Lee, J.; Kim, Joungho, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, v.2, pp.499 - 504, 2004-08-09 |
| Construction of integrated simulator for developing head/eye tracking system Kim, Joungho; Lee, D.-W.; Park, C.G.; Bang, H.-C.; Kim, J.-H.; Cho, S.-Y.; Kim, Y.-I.; et al, 2008 International Conference on Control, Automation and Systems, ICCAS 2008, pp.2485 - 2488, 2008-10-14 |
| Data-dependent Jitter using Single Pulse Analysis Method in High-speed Interconnection Kim, Joungho; Song, Eakhwan; Lee, Junho; Kim, Jingook; Kam, Dong Gun; Ryu, Chunghyun, 7th EPTC 2005, pp.810 - 813, 2005 |
| Design Comparison of I/O Port Ground and Power Plane for Enhanced ESD Immunity Kim, Joungho; Lee, Junho; Kim, Tae Hong; Kim, Hyungsoo; Ryu, Woonghwan; Choi, Jae Chun, EMC Europe 2002 International Symposium on Electromagnetic Compatibility, 2002 |
| Design Considerations of Electromagnetic Field from Wireless Power Transfer System for Portable Electronic Devices Kim, Hongseok; Choi, Chul-Seung; Park, Hyun Ho; Kim, Jonghoon; Chun, Yangbae; Kim, Joungho; Ahn, Seungyoung, 2012 Korea-Japan EMT/EMC/BE Joint Conference, 2012-05-18 |
| Design guidelines of spread spectrum clock for suppression of radiation and interference from high-speed interconnection line Kim, J.; Jun, P.; Byun, J.-G.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.189 - 192, IEEE, 2002-05-12 |
| Design of optimum terahertz transient response using finite-difference time-domain (FDTD) method Lee, Heeseok; Lee, Jongjoo; Kim, Woopoung; Lee, Jaehoon; Kim, Joungho, Proceedings of the 1998 11th Annual Meeting IEEE Lasers and Electro-Optics Society, LEOS. Part 2 (of 2), v.1, pp.221 - 222, IEEE, 1998-12-01 |
| Discontinuity cancellation to boost package bandwidth up to material's limitation Kim, Joungho, Symposium on Microelectronics (IMAPS), 2007-11-13 |
| Donut-Shaped Head Image of Birdcage Coil Using Second Harmonic Resonance Kim, Joungho; Pak, Jun so; Kim, Jonghoon; Park, Bu-Sik; Jung, Seung-pil; Jung, Kwan-Jin, 7th ISMRM99', pp.741 - 741, 1999-05 |
| Dual-line-scheme of Clock and Signal Bus of High-speed Digital Circuits and Systems for Minimizing electromagnetic Radiated Emission Kim, Joungho; Kim, HS; Kim, J; Ryu, WH, IEEE Inter. Symposium on Electromagnetic Compatibility, 1998-08 |
| Dynamic Full Wave Equation 을 이용한 RF Coil 의 자기장 분포 해석 프로그램을 이용한 3T RF Coil 의 성능 비교 김정호; 김종훈; 박준서; 고선화; 이종오; 박부식; 정관진, KSMSM 99, pp.93 -, 1999 |
| Effect of decoupling capacitor on signal integrity in applications with reference plane change Lee, J.; Lu, A.C.W.; Fan, W.; Wai, L.L.; Kim, Joungho, 53rd Electronic Components and Technology Conference, 2003, pp.1283 - 1288, IEEE, 2003-05-27 |
| Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; et al, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13 |
| Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system Kim, Joungho; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08 |
| Electrical Characteristics of Single/Coupled Stripline on Meshed Ground Plane in High-speed Package Kim, Joungho; Lee, Heeseok, International Symposium on Electronic Materials and Packagings, pp.19 - 22, 2001 |
| Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 |
| electromagnetic Radiation from Power Line Resonance of High-Speed Digital VLSI Circuits Kim, Joungho; Kim, JH; Kim, HS; Joo, SY, 5th Inter. Conf. on VLSI and CAD561, 1997-10 |
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