DSpace at KOASAS: Effects of Silica Filler Size and Contents in Non-Conductive Film (NCF) on Micro-bump Interconnection and Chip-On-Board (COB) reliability

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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Effects of Silica Filler Size and Contents in Non-Conductive Film (NCF) on Micro-bump Interconnection and Chip-On-Board (COB) reliability

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Lee, Soon-Bok researcher / Bae, J.S. / Shin, J.W. / Paik, K.W.

Publisher: International Conference on Experimental Mechanics 2014

Issue Date: 2014-11-17

Language: ENG

Citation: International Conference on Experimental Mechanics 2014

URI: http://hdl.handle.net/10203/193364

Appears in Collection: ME-Conference Papers(학술회의논문)

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Effects of Silica Filler Size and Contents in Non-Conductive Film (NCF) on Micro-bump Interconnection and Chip-On-Board (COB) reliability

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