Effects of Silica Filler Size and Contents in Non-Conductive Film (NCF) on Micro-bump Interconnection and Chip-On-Board (COB) reliability
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Lee, Soon-Bok | - |
| dc.contributor.author | Bae, J.S. | - |
| dc.contributor.author | Shin, J.W. | - |
| dc.contributor.author | Paik, K.W. | - |
| dc.date.accessioned | 2015-01-29T05:20:46Z | - |
| dc.date.available | 2015-01-29T05:20:46Z | - |
| dc.date.created | 2014-12-24 | - |
| dc.date.issued | 2014-11-17 | - |
| dc.identifier.citation | International Conference on Experimental Mechanics 2014, v., no., pp. - | - |
| dc.identifier.uri | http://hdl.handle.net/10203/193364 | - |
| dc.language | ENG | - |
| dc.publisher | International Conference on Experimental Mechanics 2014 | - |
| dc.title | Effects of Silica Filler Size and Contents in Non-Conductive Film (NCF) on Micro-bump Interconnection and Chip-On-Board (COB) reliability | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | International Conference on Experimental Mechanics 2014 | - |
| dc.identifier.conferencecountry | Singapore | - |
| dc.contributor.localauthor | Lee, Soon-Bok | - |
| dc.contributor.nonIdAuthor | Bae, J.S. | - |
| dc.contributor.nonIdAuthor | Shin, J.W. | - |
| dc.contributor.nonIdAuthor | Paik, K.W. | - |
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