On-Chip PDN (Power Distribution Network) Comparison between Single Chip and Stacked Multi-Chips with TSV (Through Silicon Via)
- Publisher
- IEEE
- Issue Date
- 2009-05-14
- Language
- ENG
- Citation
2009 Korea-Japan Joint Conference, pp.139 - 142
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
- [Sub-09.03.03]KJJC09_JunSoPak_final.pdf(214.05 kB)Download
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