| 69 | Improvement of copper diffusion barrier properties of tantalum nitride films by incorporating ruthenium using PEALD Kim, Sung-Wook; Kwon, Se-Hun; Jeong, Seong-Jun; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.11, pp.H885 - H888, 2008-09 |
| 70 | Improvement of morphological stability of PEALD-iridium thin films by adopting two-step annealing process Kim, Sung-Wook; Kwon, Se-Hun; Jeong, Seong-Jun; Park, Jin-Seong; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.11, no.11, pp.H303 - H305, 2008-09 |
| 71 | Improvement of Surface Morphology of Aluminum Thin Films Grown by Metallorganic Chemical Vapor Deposition Ahn, Seong-Deok; Lee, Hyun-Bae; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.3, no.4, pp.186 - 188, 2000-04 |
| 72 | Improvement of the dielectric properties of Ta2O5 and SiO2 based laminated materials Kang, Sang-Won, Atomic Layer Deposition 2002, ALD, 2002-08 |
| 73 | Improvement of the morphological stability by stacking RuO2 on ru thin films with atomic layer deposition Kwon, Se-Hun; Kwon, Oh-Kyum; Kim, Jae-Hoon; Jeong, Seong-Jun; Kim, Sung-Wook; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.154, no.9, pp.H773 - H777, 2007 |
| 74 | Increment of dielectric properties of SrTiO3 thin films by SrO interlayer on Ru bottom electrodes Ahn, Ji-Hoon; Kim, Ja-Yong; Kang, Sang-Won, APPLIED PHYSICS LETTERS, v.91, no.6, 2007-08 |
| 75 | Increment of the Dielectric Constant of Ta2O5 Thin Films by Retarding Interface Oxide Growth on Si Substrates Song, Hyun-Jung; Lee, Choon-Soo; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.4, no.7, pp.F13 - F14, 2001-07 |
| 76 | Influence of substrate bias voltage on structure and properties of Cr-Mo-Si-N coatings prepared by a hybrid coating system Hong, Seung Gyun; Kwon, Se-Hun; Kang, Sang-Won; Kim, Kwang Ho, SURFACE & COATINGS TECHNOLOGY, v.203, no.5-7, pp.624 - 627, 2008-12 |
| 77 | Initial stages of ruthenium film growth in plasma-enhanced atomic layer deposition Kwon, Se-Hun; Kwon, Oh-Kyum; Kim, Jin-Hyock; Oh, Heung-Ryong; Kim, Kwang-Ho; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.155, no.5, pp.H296 - H300, 2008-03 |
| 78 | Interface effect on dielectric constant of HfO2/Al 2O3 nanolaminate films deposited by plasma-enhanced atomic layer deposition Park, Pan Kwi; Cha, Eun-Soo; Kang, Sang-Won, APPLIED PHYSICS LETTERS, v.90, no.23, pp.232906, 2007-06 |
| 79 | Interfacial reaction in the sputter-deposited SiO2/Ti0.1W0.9 antifuse system Baek, Jong Tae; Park, Hyung-Ho; Cho, Kyung-Ik; Yoo, Hyung Joun; Kang, Sang-Won; Ahn, Byung Tae, JOURNAL OF APPLIED PHYSICS, v.78, no.12, pp.7074 - 7079, 1995-12 |
| 80 | Investigation of link formation in a novel planar-type antifuse structure Baek, Jong Tae; Park, Hyung-Ho; Kang, Sang-Won; Ahn, Byung Tae; Yoo, Hyung Joun, THIN SOLID FILMS, v.288, no.1-2, pp.41 - 44, 1996-11 |
| 81 | Investigation of link formation in a novel planar-type antifuse structure Baek, Jong Tae; Park, Hyung-Ho; Kang, Sang-Won; Ahn, Byung Tae; Yoo, Ilyung, Thin Solid Films, 288, 41-44, 1996-02-20 |
| 82 | Investigation of link formation in a novel planar-type antifuse structure Baek, Jong Tae; Park, Hyung-Ho; Kang, Sang-Won; Ahn, Byung Tae; Yoo, Hyung-Joun, Thin Solid Films 288 (1996) 41--44, 1996-02 |
| 83 | Kinetic model for cavity filling in CECVD of copper = 촉매 처리에 의한 구리 CECVD의 cavity filling 현상에 관한 모델link Lee, Hyun-Bae; 이현배; et al, 한국과학기술원, 2005 |
| 84 | Kinetic Modeling for Multi-Component Thin Film Growth in Plasma Enhanced Atomic Layer Deposition Kang, Sang-Won, 203rd ECS Meeting, ECS, 2003-04 |
| 85 | Kinetic modeling of film growth rates of TiN films in atomic layer deposition Lim, Jung-Wook; Park, Jin-Seong; Kang, Sang-Won, JOURNAL OF APPLIED PHYSICS, v.87, no.9, pp.4632 - 4634, 2000-05 |
| 86 | Measurement of thermal expansion coefficient of poly-Si using microgauge sensors Chae, Jung-Hun; Lee, Jae-Youl; Kang, Sang-Won, SPIE Vol. 3242, pp.202-211, 1997 |
| 87 | Measurement of thermal expansion coefficient of poly-Si using microgauge sensors Chae, JH; Lee, JY; Kang, Sang-Won, SENSORS AND ACTUATORS A-PHYSICAL, v.75, no.3, pp.222 - 229, 1999-06 |
| 88 | Metalorganic chemical vapor deposition of copper on ruthenium thin film Kwak, Dong-Kee; Lee, Hyun-Bae; Han, Jae-Won; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.9, no.10, pp.C171 - C173, 2006 |
| 89 | Metal–organic atomic-layer deposition of titanium–silicon–nitride films Min, Jae-Sik; Park, Hyung-Sang; Kang, Sang-Won, APPLIED PHYSICS LETTERS 99 75(11) 1521-1523, 1999-07-19 |
| 90 | Optimizing electrical and mechanical properties of reaction-sintered SiC by using different-sized SiC particles in preform Jeon Y.-S.; Shin H.; Park J.-S.; Kang, Sang-Won, 한국세라믹학회지, v.45, no.8, pp.439 - 442, 2008 |
| 91 | Phase control of iridium and iridium oxide thin films in atomic layer deposition Kim, Sung-Wook; Kwon, Se-Hun; Kwak, Dong-Kee; Kang, Sang-Won, JOURNAL OF APPLIED PHYSICS, v.103, no.2, 2008-01 |
| 92 | Plasma enhanced atomic layer deposition of transition metal nitrides (Invited talk) Kang, Sang-Won, Atomic Layer Deposition conference, ALD, 2001-05 |
| 93 | Plasma-Enhanced Atomic Layer Deposition of Aluminum Grown by a Sequential Supply of TMA and H2 Kang, Sang-Won, 3rd International AVS Conference on Microelectronics and Interfaces, ICMI, 2002-02 |
| 94 | Plasma-enhanced atomic layer deposition of Ta-N thin films Park, JS; Park, HS; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.149, no.1, pp.28 - 32, 2002-01 |
| 95 | Plasma-enhanced atomic layer deposition of TaN thin films using tantalum-pentafluoride and N-2/H-2/Ar plasma Chung, Hoi-Sung; Kwon, Jung-Dae; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.153, no.11, pp.C751 - C754, 2006 |
| 96 | Plasma-enhanced atomic layer deposition of tantalum nitrides using hydrogen radicals as a reducing agent Park, JS; Lee, MJ; Lee, CS; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.4, no.4, pp.17 - 19, 2001-04 |
| 97 | Reduced electrical resistivity of reaction-sintered SiC by nitrogen doping Jeon, Young-Sam; Shin, Hyunho; Lee, Young-Hyun; Kang, Sang-Won, JOURNAL OF MATERIALS RESEARCH, v.23, no.4, pp.1020 - 1025, 2008-04 |
| 98 | Reduction of Leakage Current at the Gate Edge of SDB SO1 NMOS Transistor Kang, Sung-Weon; Lyu, Jong-Son; Kang, Jin-Young; Kang, Sang-Won; Lee, Jin-Hyo, IEEE ELECTRON DEVICE LETTERS, v.16, no.6, pp.236 - 236, 1995-06 |
| 99 | Slurry thickness에 따른 CMP modeling에 관한 연구 = A study on the modeling of chemical-mechanical polishing (CMP) depending on slurry thicknesslink 김우찬; Kim, Woo-Chan; et al, 한국과학기술원, 2003 |
| 100 | Step coverage modeling of thin films in atomic layer deposition Kim, Ja-Yong; Ahn, Ji-Hoon; Kang, Sang-Won; Kim, Jin-Hyock, JOURNAL OF APPLIED PHYSICS, v.101, no.7, 2007-04 |
| 101 | Studies on Microvoids at the Interface of Direct Bonded Silicon Wafers Yun, Sun-Jin; Ahn, Kun-Young; Yi, Kyoung-Soo; Kang, Sang-Won, Journal of The Electrochemical Society, 139(8), 2326-2330, 1992-08 |
| 102 | STUDIES ON MICROVOIDS AT THE INTERFACE OF DIRECT BONDED SILICON-WAFERS Yun, Sun-Jin; Ahn, Kun-Young; Yi, Kyoung-Soo; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.139, no.8, pp.2326 - 2330, 1992-08 |
| 103 | A Study of Cu Metal Deposition on Amorphous Si Film from Cu solution for Low-Temperature Crystallization of Amorphous Si Films Sohn, Dong-Hyun; Lee, Jeong No; Kang, Sang-Won; Ahn, Byung Tae, Journal of The Electrochemical Society, vol.144, no.10, pp.3592-3596, 1997-07-01 |
| 104 | Study of Interaction between Incident Silicon and Germanium Fluxes and SiO2 Layer Using Solid-Source Molecular Beam Epitaxy Yun, Sun-Jin; Lee, Seung-Chang; Kim, Bo-Woo; Kang, Sang-Won, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.12, no.2, pp.1167 - 1169, 1994-03 |
| 105 | Surface morphology improvement of metalorganic chemical vapor deposition Al films by layered deposition of Al and ultrathin TiN Ahn, Seong-Deok; Lee, Hyun-Bae; Kang, Sang-Won, JAPANESE JOURNAL OF APPLIED PHYSICS, v.39, no.6A, pp.3349 - 3354, 2000-06 |
| 106 | The Characteristics of tantalum nitride films Deposited by plasma enhanced atomic layer deposition using hydrogen radical as reduced agent Kang, Sang-Won, The Second Asian Conference on Chemical Vapor Deposition, Asian Conference on Chemical Vapor Deposition, 2001-05 |
| 107 | THE EFFECT OF AMORPHOUS-SILICON CAPPING ON TITANIUM DURING TISI2 FORMATION BY RTA Kang, Sang-Won; Park, Sin Chong; Chun , Soung Soon, JOURNAL OF MATERIALS SCIENCE, v.25, no.1A, pp.98 - 102, 1990-01 |
| 108 | The Mechanism of Si Incorporation and the Digital Control of Si Content during the Metallorganic Atomic Layer Deposition of Ti-Si-N Thin Films Min, Jae-Sik; Park, Jin-Seong; Park, Hyung-Sang; Kang, Sang-Won, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.147, no.10, pp.3868 - 3872, 2000-06 |
| 109 | (The) effect of $H_2$ plasma treatment on the film growth rate in catalytic-enhanced Cu CVD = 촉매를 이용한 Cu CVD의 증착속도에 대한 수소 플라즈마의 효과 연구link Kwon, Oh-Kyum; 권오겸; et al, 한국과학기술원, 2001 |
| 110 | (The) microstructure and electrical property of $HfO_2/Al_2O_3$ films deposited by atomic layer deposition = 원자층 증착법으로 형성된 $HfO_2/Al_2O_3$ 박막의 결정 구조 변화 및 전기적 특성에 관한 연구link Park, Pan-Kwi; 박판귀; et al, 한국과학기술원, 2007 |
| 111 | Theoretical evaluation of film growth rate during atomic layer epitaxy Park, Hyung-Sang; Min, Jae-Sik; Lim, Jung-Wook; Kang, Sang-Won, APPLIED SURFACE SCIENCE, v.158, no.1-2, pp.81 - 91, 1999-12 |
| 112 | Theoretical Simulation of Surface Evolution Using the Random Deposition and Surface Relaxation for Metal Oxide Film in Atomic Layer Deposition Ahn, Ji-Hoon; Kwon, Se-Hun; Kim, Jin-Hyock; Kim, Ja-Yong; Kang, Sang-Won, JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, v.26, no.4, pp.371 - 374, 2010-04 |
| 113 | Thermal stability of RuO2 thin films prepared by modified atomic layer deposition Kim, Jin-Hyock; Ahn, Ji-Hoon; Kang, Sang-Won; Roh, Jae-Sung; Kwon, Se-Hun; Kim, Ja-Yong, CURRENT APPLIED PHYSICS, v.12, pp.S160 - S163, 2012-09 |
| 114 | Ti 박막으로 부터 급속 열처리에 의한 $TiSi_2$ 형성에 관한 연구 = A study on the formation of $TiSi_2$ from thin Ti film by rapid thermal processlink 강상원; Kang, Sang-Won; 천성순; 박신종; et al, 한국과학기술원, 1990 |
| 115 | Ti-Al-N Thin Films Prepared by the Combination of Metallorganic Plasma-Enhanced Atomic Layer Deposition of Al and TiN Lee, Yong Ju; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.6, no.5, pp.C70 - C72, 2003-03 |
| 116 | TiO2/Al2O3/TiO2 nanolaminated thin films for DRAM capacitor deposited by plasma-enhanced atomic layer deposition Jeon, Woojin; Chung, Hoi-Sung; Joo, Daekwon; Kang, Sang-Won, ELECTROCHEMICAL AND SOLID STATE LETTERS, v.11, no.2, pp.H19 - H21, 2008 |
| 117 | Titanium isopropoxide와 ammonia를 이용하는 촉매화학기상증착법에 의한 $TiO_2$ 박막 형성에 관한 연구 = A study on the formation of $TiO_2$ thin films using titanium isopropoxide and ammonia by catalytic CVDlink 정승훈; Jung, Seung-Hoon; et al, 한국과학기술원, 2001 |
| 118 | 급속열산화법을 이용한 게이트용 산화막 성장기구에 관한 연구 = Kinetics of rapid thermal oxidation of siliconlink 심규찬; Shim, Kew-Chan; et al, 한국과학기술원, 1996 |
| 119 | 분할 화학증착방법으로 증착된 알루미늄 박막의 선택성 및 표면 morphology 개선에 관한 연구 = A study on the improvement of the selectivity and surface morphology of al thin film by cycle chemical vapor depositionlink 안상덕; Ahn, Seong-Deok; 강상원; 천성순; et al, 한국과학기술원, 2000 |
| 120 | 산화-환원 ALD 증착법에 의해 형성된 Nickel 박막의 특성에 관한 연구 = A study on the nickel thin films formed by oxidation-reduction ALDlink 채정헌; Chae, Jung-Hun; et al, 한국과학기술원, 2002 |
| 121 | 스위치 소자용 열구동형 다결정 실리콘 마이크로브릿지의 열적 구동특성 연구 = A study on the actuations characteristics of thermally-driven polycrystalline silicon microbridge for switching device applicationslink 이재열; Lee, Jae-Youl; et al, 한국과학기술원, 1999 |
| 122 | 왕겨로 부터 Si3N4형성에 관한 속도론적 연구 = The kinetics of silicon nitride formation from korean rice hullslink 강상원; Kang, Sang-Won; et al, 한국과학기술원, 1978 |
| 123 | 원자층 단위 증착법으로 증착된 TiN 증착기구에 대한 모델 연구 = A study of the deposition model about ALD (atomic layer deposition) TiN methodlink 박진성; Park, Jin-Seong; et al, 한국과학기술원, 1999 |
| 124 | 질소 도핑된 반응소결 탄화규소 히터의 특성 = The properties of nitrogen-doped SiC heater prepared by reaction sinteringlink 전영삼; Jeon, Young-Sam; et al, 한국과학기술원, 2008 |
| 125 | 테스트 패턴을 이용한 다결정 실리콘 박막의 열팽창 계수 측정에 관한 연구 = Measurement of thermal expansion coefficient of polycrystalline silicon thin film by micro test patternslink 채정헌; Chae, Jung-Hun; et al, 한국과학기술원, 1997 |
| 126 | 화학적 기계적 연마의 광학적 End-point detection 알고리즘에 관한 연구 = A study on the algorithm of optical end-point dectection for chemical mechanical polishinglink 노용주; Roh, Yong-Ju; et al, 한국과학기술원, 1998 |
