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Showing results 1 to 6 of 6

1
Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF

Lee, Soon-Bok; Paik, Kyung-Wook; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002

2
Analytical approach to evaluate shear stress in flip chip interconnection using NCA/ACF

Yang, SY; Kwon, WS; Lee, SB; Paik Kyung-Wook, 5th International Symposium on Electronic Materials and Packagings 2003, 2003-11

3
Chip warpage damage model for ACA film type electronic packages

Yang, SY; Kwon, WS; Lee, Soon-Bok; Paik, Kyung-Wook, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4 BOOK SERIES: KEY ENGINEERING MATERIALS, v.297-300, no.2, pp.1 - 4, 2005

4
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

Yang, SY; Jeon, YD; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.46, pp.512 - 522, 2006-02

5
The effect of Tg on thermo-mechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling

Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, Proceedings - 54th Electronic Components and Technology Conference, pp.1731 - 1737, IEEE, 2004-06-01

6
The experimental and theoretical approaches of contraction stress build-up of anisotropic conductive adhesives for flip chip interconnection

Kwon, WS; Yang, SY; Lee, Soon-Bok; Paik, Kyung-Wook, 55th Electronic Components and Technology Conference, ECTC, pp.1468 - 1474, IEEE, 2005-05-31

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